FIELD: electronic equipment.
SUBSTANCE: invention relates to electronic equipment, namely to the cathode-mesh assembly (CMA) manufacturing method, intended for use in electronic instruments with field emission. Method comprises use of the field-emission cathode located on a substrate, on the working surface having the micro-tips array, and the electrically isolated from the cathode mesh with fixation of their mutual arrangement. Method features consist in the fact, that electrically insulating dividing spacer 3 is installed on the substrate 2, on which a flat metallized dielectric film 9 is fixed on one side, placing it parallel to the cathode 1 surface and by the metallization layer 5 orienting in the direction opposite to the cathode 1. Produced article is placed in the evacuated housing 21, having anode 22, with production of triode having this anode, cathode 1 and electrode in the form of layer 5. Connecting the voltage source 26 positive pole to the anode 1, the source 27 positive pole is to the layer 5, negative poles of both sources are to the cathode 1. With the source 26 maximum voltage, which does not cause a breakdown, gradually, starting from zero, increasing the source 27 voltage, observing the current appearance in this source circuit, its increasing, and then decreasing, and stopping the source 27 voltage increasing when the current in its circuit disappears or stabilizes at the minimum level. At that, in the dielectric layer 4 and the film 9 metallization layer 5, holes are burned and mesh is formed. After this, disconnecting all electrodes from the sources, which results in production of the cathode-mesh assembly, comprising field-emission cathode 1 placed on the substrate 2 and, as a mesh, is the said film with holes, burned through in its dielectric material and metallization layer 5, mechanically coupled to the substrate 1 through the dividing spacer 3.
EFFECT: technical result is increase in the cathode emission properties.
11 cl, 3 dwg
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Authors
Dates
2018-05-11—Published
2017-03-07—Filed