FIELD: electronic equipment.
SUBSTANCE: invention relates to electronic equipment, in particular to cathode-mesh assemblies (CMA) with field emission cathodes manufacturing method for vacuum SHF electronic devices with a microsecond readiness time. Vacuum electronic device cathode-mesh assembly manufacturing method includes manufacturing of the multi-tip field emission cathode and pulling grid with apertures for each tip, tips alignment with holes in the mesh with diameters D and its securing. At that, on the cathode discs forming workpieces for tip cathodes in the form of cylindrical projections with diameters of d < D, where d is the cylindrical projections diameter. Next, fixing the mesh in such a way that the future cathodes workpieces cylindrical projections ends were located in the mesh openings, and then by the method of micrometer laser milling through the holes in the mesh, forming the tips in the form of needles with base diameter equal to the diameter of projections. At that, the ends of the cylindrical projections are located in the holes at the level of mesh outer plane.
EFFECT: technical result is equalization of currents in all cells and increase in the CMA operation reliability.
1 cl, 3 dwg
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Authors
Dates
2018-06-07—Published
2017-02-28—Filed