METHOD OF MANUFACTURING THREE-DIMENSIONAL ELECTRONIC MODULE Russian patent published in 2018 - IPC H01L25/04 

FIELD: radio engineering, communication.

SUBSTANCE: module is designed so that on the faces of the parts to be joined after the workpiece is divided, the contact pads are opposite each other, in any known way, the workpiece is made, the workpiece is divided into two parts, the chip contacts and the boards are chemically machined to remove oxides and impurities, a removable or non-removable stencil and solder balls are used, and the two parts are connected so that the heat sink bases are located outside the module, soldering control is performed, air cavity is filled with an epoxy adhesive, grinding of the finished module ends is performed to remove residual adhesive and break pads. When the number of connected parts of more than two to one "lower" part of the module, the "upper" parts of the module are installed in one layer so that the total area of "upper" parts is equal to the area of the "lower" parts, and their heat-removing bases are outside the module.

EFFECT: improving the heat removing of the electronic module and increasing its mechanical strength.

2 cl, 9 dwg