METHOD FOR DETERMINING POSITION OF SUBSTRATE IN LITHOGRAPHIC SYSTEM, SUBSTRATE FOR USE IN SUCH METHOD AND LITHOGRAPHIC SYSTEM FOR IMPLEMENTATION OF SUCH METHOD Russian patent published in 2018 - IPC G03F9/00 G03F7/20 

Abstract RU 2659967 C2

FIELD: lithography.

SUBSTANCE: invention relates to the field of lithography and relates to a system for determining the position of a substrate in a lithography system. System comprises an optical column, an optical alignment sensor element and a substrate comprising an optical position marker. Sensor element is configured to emit a light beam onto the substrate and measure the beam intensity profile of the reflected light of zero order. Optical market comprises a main region comprising a plurality of pairs of regions, the pair of regions being equal to each other. Each pair of regions comprises first and second regions having different reflection coefficients. Width of the first and second regions and the size of the light spot are in the range of 1 mcm to 2 mcm. First region comprises structures that are sub-wavelength compared to the wavelength of the emitted light beam. Sub-wavelength structures comprise a plurality of regular segments formed by segmenting a first region along a first direction and / or a second direction, the second direction being perpendicular to the first direction.

EFFECT: technical result consists in higher accuracy of determining the position of the substrate.

18 cl, 20 dwg

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RU 2 659 967 C2

Authors

De Bur Gvido

Verger Nils

Dates

2018-07-04Published

2013-10-28Filed