ELECTRONIC ASSEMBLY, WHICH INCLUDES THE ELECTRONIC DEVICES THAT ARE STACKED ONTO EACH OTHER Russian patent published in 2018 - IPC H01L25/04 

FIELD: electronic equipment.

SUBSTANCE: invention relates to electronic devices, which are stacked onto each other. Electronic assembly comprises the first electronic device, which includes the cavity that is deepened into the back side of the first electronic device, wherein the first electronic device includes the intermediate plate on the front side of the first electronic device, the cavity in the first electronic device is deepened through the first electronic device to the intermediate plate, and the electronic assembly also comprises the second electronic device, which is mounted on the first electronic device within the cavity in the first electronic device. In some exemplary forms of the electronic assembly, the first electronic device and the second electronic device are a crystal. It should be noted that other forms of the electronic assembly are being considered, where only one of the first electronic device and the second electronic device is a crystal. In some forms of the electronic assembly, the second electronic device is soldered to the first electronic device.

EFFECT: invention provides for the increased efficiency of heat dissipation.

18 cl, 12 dwg