FIELD: physics.
SUBSTANCE: invention relates to integrated electronic micro fluid device Proposed device comprises semiconductor substrate 106 on first support 122, electronic circuit 102, 104 on first side of said substrate and signal interface with external device. Signal interface is arranged on substrate to receive electric signals from electronic circuit. Micro fluid structure 126 is arranged in semiconductor substrate to limit fluid medium and allow it to flow in and out of said structure solely on second side of substrate opposite the first side and directed therefrom. Proposed device makes adaptable carrier for producing various versions of encased systems. Distinct division is ensured between electric and chemical-fluid interfaces.
EFFECT: simple fabrication of heat-insulated micro fluid structures.
15 cl, 7 dwg
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