FIELD: wood industry.
SUBSTANCE: on the top side or bottom side first a layer of liquid resin is put, then at least one impregnated with synthetic resin paper layer and then this structure is pressed under high press pressure and at high temperature, moreover, the synthetic resin melts and connects with the top side or the bottom side of the chipboard, which is characterized in that the top side and/or bottom side is also supplies by the pressing film is made uncut, and the layer applied is so thin that liquid synthetic resin is fully drawn into the pressing film, any active drying of layer is not performed and a paper layer is superimposed on the pressing film.
EFFECT: improvement of the method.
13 cl, 3 dwg
