FIELD: technological processes.
SUBSTANCE: invention relates to the field of electroplating and can be used for coating a copper-nickel alloy. Electrolyte contains: a copper salt and a nickel salt, forming a complex substance with metal, providing a conductivity salt, a sulfur-containing organic compound and regulator of the oxidation-reduction potential of the electrolyte during the coating operation, which is greater than or equal to 20 mV relative to the Ag/AgCl reference electrode. This electrolyte can be coated at any ratio of copper and nickel in the alloy.
EFFECT: coating has homogeneous composition over a wide range of current densities, the electrolyte has high stability and a long service life.
13 cl, 7 tbl, 15 ex
| Title | Year | Author | Number |
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