METHOD OF ASSEMBLING THREE-DIMENSIONAL INTEGRATED 3D BIS CIRCUITS Russian patent published in 2016 - IPC H01L23/538 

Abstract RU 2584180 C2

FIELD: electronics.

SUBSTANCE: invention relates to electronics and is designed for manufacture of three-dimensional (3D) LSI circuits. Method of assembling 3D LSI circuits includes an operation of mounting 3D chips on each other, followed by connecting each chip to housing using leads. Chips are mounted in series, wherein connection of chips with housing is carried out using leads fastened to a polyimide tape.

EFFECT: technical result of invention is to reduce production costs and increase reliability.

1 cl, 9 dwg

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RU 2 584 180 C2

Authors

Zenin Viktor Vasilevich

Achkasov Aleksandr Vladimirovich

Kolbenkov Anatolij Aleksandrovich

Stojanov Andrej Anatolevich

Dates

2016-05-20Published

2014-07-17Filed