FIELD: electronics.
SUBSTANCE: invention relates to electronics and is designed for manufacture of three-dimensional (3D) LSI circuits. Method of assembling 3D LSI circuits includes an operation of mounting 3D chips on each other, followed by connecting each chip to housing using leads. Chips are mounted in series, wherein connection of chips with housing is carried out using leads fastened to a polyimide tape.
EFFECT: technical result of invention is to reduce production costs and increase reliability.
1 cl, 9 dwg
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