FIELD: physics, optics.
SUBSTANCE: invention can be used in different optoelectronic equipment for detecting infrared radiation. The photodetector module based on PbSe, according to the invention, is a hybrid microassembly consisting of a photosensitive element in form of a PbSe-based line and a reading LSI chip (multiplexer), connected to each other by flip-chip method, wherein indium columns are deposited on terminals of solder pads of the photosensitive element which, besides layers of Cr, Pd, An, contain a sublayer of Cr and In, and mated with the indium columns deposited on the reading LSI chip to form an electrical and a mechanical bond.
EFFECT: invention makes assembly considerably easy and increases the efficiency of manufacture using a batch cold welding method, which in turn enables to make the photodetector module in form of a hybrid assembly and mount the reading LSI chip on the photosensitive element, reduce size and increase reliability.
3 dwg
| Title | Year | Author | Number | 
|---|---|---|---|
| METHOD FOR MANUFACTURE OF PbS-BASED PHOTORECEIVING MODULE | 2012 | 
 | RU2515960C1 | 
| MICROCONTACT FOR PHOTO-RECOMMENDED HYBRID MICROCIRCUIT | 2016 | 
 | RU2621889C1 | 
| METHOD OF MAKING INDIUM STUDS | 2008 | 
 | RU2371808C1 | 
| MULTICHIP POLYCHROMATIC PHOTO RECEIVER (PR) WITH EXPANDED SPECTRAL RESPONSE OF QUANTUM EFFICIENCY | 2014 | 
 | RU2564813C1 | 
| DUAL SPECTRUM PHOTODETECTOR (VERSIONS) | 2009 | 
 | RU2388115C1 | 
| METHOD FOR MANUFACTURING INDIUM MICROCONTACTS | 2014 | 
 | RU2571436C1 | 
| METHOD OF ON-LINE INSPECTION OF THE DOCKING QUALITY | 2017 | 
 | RU2660020C1 | 
| METHOD OF ASSEMBLING PHOTOSENSITIVE MODULE ON RASTER | 2015 | 
 | RU2580184C1 | 
| METHOD OF ASSEMBLING INFRARED PHOTODETECTOR | 2013 | 
 | RU2526489C1 | 
| METHOD OF LOWERING OF OHMIC RESISTANCE OF INDIUM MICROCONTACTS USING THERMAL ANNEALING | 2013 | 
 | RU2537085C1 | 
Authors
Dates
2014-05-10—Published
2012-11-12—Filed