FIELD: manufacturing technology.
SUBSTANCE: invention relates to the multilayer integrated structures for aerospace, automotive, shipbuilding and other areas of technology, where the multifunctional products with high stiffness properties and low specific weight are required, and relates to the multilayer structures manufacturing method. Method comprises the base plating placement on the forming surface, the structural elements assembling on the base plating using the bonding adhesive layers, the honeycomb core layer placement on the base plating, the final plating laying, during the structural elements each layer laying on the base plating, performing the restrictive frame installation along the base plating and the technological base device contour, at that the technological base device and auxiliary elements are made of materials, whose thermal expansion coefficient is close to the construction material thermal expansion coefficient, at that, sequentially performing the installation, positioning with the help of supporting elements, which height is always greater than the technological base unit height by an amount of not less than the bonding adhesive initial thickness, performing the structural elements pre-pressing and fixation, then above the embedded structural elements making the technological package layer-by-layer placement with the thin overlay sheet and drainage compensating layers from the soft materials, then installing the sealing cover with pre-assembled fittings for connection to the vacuum system, performing the fixing and sealing around the limiting frame contour, evacuation and the overpressure building-up, then performing the holding at the gluing mode, stopping the vacuuming, removing the sealing cover and the technological package, the technological base unit dismantling, monitoring the embedded elements positioning accuracy and the bonding quality, and before the final skin placement, performing the connected thereto surface alignment.
EFFECT: invention enables increase in the manufactured without defects and the bonding (adhesive) layers sagging products quality, reduction in the products repair and modification costs, as well as the structure functionality expansion due to the possible defect-free installation of different in the configuration and purpose embedded elements.
1 cl, 2 dwg
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Authors
Dates
2019-02-01—Published
2017-09-14—Filed