FIELD: physics.
SUBSTANCE: invention relates to electronics, namely to designs of housings for power amplifiers, and can be used for removal of thermal radiation from electronic components of amplifier, as well as their shielding from electromagnetic radiation. Technical result is achieved by that power amplifier housing includes base, wall and covers connected to make a cavity for arrangement of electronic modules of amplifier. Base is made in the form of plate from material with high coefficient of heat conductivity (copper, aluminium, etc.), having fastening holes and mounting platforms for attachment of electronic modules of amplifier. Wall is made from aluminium alloy and is connected to the base by a spike-slot connection, and the covers are made from aluminium alloy and are connected to the wall by a slot-groove type connection.
EFFECT: technical result consists in improvement of heat-removing and strength properties of housing with simultaneous provision of electromagnetic screening of electronic components of power amplifier.
5 cl, 3 dwg
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