METAL MATERIAL FOR ELECTRONIC SYSTEM AND METHOD OF ITS MANUFACTURING Russian patent published in 2015 - IPC C25D7/00 H01R13/03 B32B15/01 

FIELD: metallurgy.

SUBSTANCE: invention relates to metal material for electronic component, connecting connector, daisy chain connector, connector of flexible PCB, where for the contact part the said metal material is used, and to electronic component, in which the said metal material is used as electrode for external connection. The said metal material contains metal materials of base, layer A being surface layer on base material and made out of Sn, In or their alloy, and layer B being middle layer between the base material and layer A and made out of Ag, Au, Pt, Pd, Ru, Rh, Os, Ir or their alloy, at that the surface layer (layer A) corresponds to the following conditions (i) and (ii): (i) surface layer (layer A) thickness is from 0.002 to 0.2 mcm, (ii) quantity of deposited Sn or In is from 1 to 150 mcg/cm², and middle layer (layer B) corresponds to the following conditions (iii) and (iv): (iii) middle layer (layer B) thickness is from 0.001 to 0.3 mcm, (iv) quantity of deposited Ag, Au, Pt, Pd, Ru, Rh, Os or Ir is in range from 1 to 330 mcg/cm².

EFFECT: electronic component out of said metal material characterised by low insertion and withdrawal, and having high durability.

21 cl, 3 dwg, 22 tbl, 21 ex