FIELD: methods and devices for metal processing.
SUBSTANCE: invention can be used in making a connection structure for soldering structural elements, in particular electrical parts. Soldered connection structure (50), which must be connected to the element by means of solder material, contains aluminium substrate (30) and metal film (40) produced on aluminium substrate (30). Metal film (40) is formed by a method of cold spraying, in which a powdered material of a mixture of powder (41) of Ni and powder (42) of Sn is used in a given ratio.
EFFECT: connecting structure and method for obtaining metal film on main material from aluminium provides high wettability of solder.
3 cl, 15 dwg
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