TITANIUM-COPPER MATERIAL FOR ELECTRONIC COMPONENTS Russian patent published in 2019 - IPC C22C9/00 H01B1/02 C22F1/08 

FIELD: metallurgy.

SUBSTANCE: invention relates to metallurgy, particularly, to titanium-copper materials for electronic components. It can be used, for example, in connectors, clamps of accumulators, plugs, relays, switches, video camera modules. Titanium-copper material contains from 2.0 to 4.5 wt% of Ti, at least one element selected from a group consisting of Fe, Co, Ni, Cr, Zn, Zr, P, B, Mo, V, Nb, Mn, Mg and Si, in total amount from 0 to 0.5 wt% and copper and unavoidable impurities – the rest. Deformation hardening index is in range from 0.05 to 0.25, integral X-ray diffraction intensity I {200} for crystallographic plane {200} on surface of titanium-copper material and integral intensity of X-ray diffraction I₀ {200} of the refined copper powder standard satisfies the following relationship: 0.15 ≤ I {200} / I₀ {200} ≤ 0.70.

EFFECT: improved processability when bending titanium-copper material.

6 cl, 1 tbl, 1 ex