TITANIUM-COPPER MATERIAL FOR ELECTRONIC COMPONENTS Russian patent published in 2019 - IPC C22C9/00 H01B1/02 C22F1/08 

FIELD: metallurgy.

SUBSTANCE: invention relates to metallurgy, particularly, to titanium-copper materials for electronic components. It can be used, for example, in connectors, clamps of accumulators, plugs, relays, switches, video camera modules. Titanium-copper material contains 2.0–4.5 wt% of Ti, at least one element selected from the group: Fe, Co, Ni, Cr, Zn, Zr, P, B, Mo, V, Nb, Mn, Mg and Si, in total amount from 0 to 0.5 wt%, copper and unavoidable impurities – the rest. As a result of analysing orientation of crystals during measurement by electron backscattering diffraction with respect to surface subjected to rolling, coefficient of variation of grain size of crystals is 45 % or less when determining boundaries of crystal grain of orientation difference of 5° or more. Surface area with cubic orientation of {001} <100> is 5 % or less.

EFFECT: improved processability when bending titanium-copper material.

6 cl, 1 tbl, 1 ex