FIELD: titanium-copper materials.
SUBSTANCE: invention can be used for the manufacture of electronic components such as connectors, battery clips, plugs, relays, switches, auto focus video camera modules, etc. Titanium-copper material contains from 2.0 to 4.5 wt.% Ti, at least one element selected from the group consisting of Fe, Co, Ni, Cr, Zn, Zr, P, B, Mo, V, Nb, Mn, Mg and Si, in total from 0 to 0.5 wt.%, the rest is copper and unavoidable impurities, where the surface area of crystal grains, characterized by a GOS parameter in the range from 2 to 6°, ranges from 60 to 90%, provided that the orientation difference of 5° and more, when analyzing the orientation of crystals by the EBSD method for the surface subjected to rolling, and the surface area of crystal grains, characterized by a Schmid factor of 0.35 or less, is in the range from 5 to 20%.
EFFECT: improving the material resistance to stress relaxation.
6 cl, 18 ex, 1 tbl, 2 dwg
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