FIELD: titanium-copper materials.
SUBSTANCE: invention can be used for the manufacture of electronic components, such as connectors, battery clips, plugs, relays, switches, video camera modules with automatic focus, etc. Titanium-copper material contains from 2.0 to 4.5 wt.% Ti, at least one element selected from the group consisting of Fe, Co, Ni, Cr, Zn, Zr, P, B, Mo, V, Nb, Mn, Mg and Si, in total from 0 to 0.5 wt.%, the rest is copper and inevitable impurities, and the material has a texture, the pole density of which at <111> is in the range from 2.5 to 4.5, and the pole density at <001> is greater than the pole density at <101> for the inverse pole figure in the rolling direction.
EFFECT: increasing the resistance of titanium-copper alloy products to stress relaxation.
6 cl, 2 dwg, 1 tbl, 18 ex
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