FIELD: radio engineering; electronics.
SUBSTANCE: invention is intended for soldering of devices in the form of waveguides or resonators, in particular waveguide devices of complex configuration from aluminum alloys. Parts are prepared for soldering, parts are assembled in units with soldering and fixation of solder in places of soldering, preheating of assembly, soldering in flux bath, removal of flux residues and quality control of soldered assemblies. Soldering is carried out with solder of Al-Si-Ge system. Method includes preliminary annealing of said solder alloy at temperature of 370 °C ± 10 °C for 10–15 minutes, holding it at room temperature for at least 30 minutes and forming solder to produce workpieces of specified shape. Solder may be formed in the form of twisted pieces.
EFFECT: disclosed is a method of soldering waveguide devices of complex configuration from aluminum alloys.
2 cl
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