FIELD: process engineering.
SUBSTANCE: invention relates to metallurgy. Proposed method comprises heating the parts to soldering temperature and holding them at said temperature. Then, soldered parts are cooled down to room temperature and thermally treated. In thermal treatment, said soldered parts are heated to temperature 5-40°C higher than that of nonequilibrium solidus of used solder. Now, soldered parts are held at said temperature for 10-100 min and cooled down to room temperature.
EFFECT: higher antirust properties and strength.
2 ex
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