FIELD: manufacturing technology.
SUBSTANCE: invention is aimed at creation of high-density inter-unit switching by flexible printed-circuit boards (loops) for movable parts of microelectronic equipment. Technical result is achieved by the fact that flexible printed circuit board has outputs arranged in three directions, which makes it possible to ensure density of arrangement of blocks at minimum distance. Design and arrangement of contact pads intended for installation of electronic units or connection of a line to other devices, shall allow to implement strong high-density interconnection in microelectronic equipment. For this purpose, on the lower side of the contact pads, process areas of polyimide release are etched for mounting on both sides of the board.
EFFECT: high density of packing cells and blocks, as well as reduced weight of connecting elements to minimize occupied volume.
1 cl, 2 dwg
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