FIELD: physics.
SUBSTANCE: pre-tested and pre-programmed frameless crystals are precision mounted in the substrates of the assembled node. The substrate of the assembled node and crystals are installed on the face of the technological substrate coated with a thin adhesive layer of thermoplastic adhesive, combining their reference signs, and the substrate of the assembled node is sealed with the crystals installed thereon, and then the technological substrate is removed, heating it to the melting temperature of the thermoplastic adhesive. Further, by sequential selective formation of dielectric and conductive layers on the active surface of the substrate of the assembled and the crystals, a multi-level switching is created with the subsequent installation of chip-components on the appropriate pads.
EFFECT: simplification of the process of manufacturing microelectronic units, increasing the packing density of components, improving the mass-dimensional characteristics of the assembly unit.
1 dwg
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