FIELD: electricity.
SUBSTANCE: invention relates to multi-wire flexible electric connections and can be used for assembly of microelectronic devices. Achieved by that firstly first set from preset number of flexible loop base components at single base is taken, forming on it specified conducting circuit, for which is making series of through longitudinal slots using laser cutting method, then taking second set of flexible loop combined components, on which by laser cutting method openings for contact pads are formed, having transverse orientation relative to first set conductors, with further combination of first and second sets corresponding components, formed on single base by group method so, that contact pads openings of flexible loop combined components coincided with flexible loop base components conductors edge sections, produced sets are connected by thermocompressive welding with production of flexible loops group assembly on one base, then this assembly is divided into individual articles by laser cutting.
EFFECT: improved processability of flexible loops fabrication and further micro-assemblies elements connecting process using these flexible loops.
1 cl, 8 tbl, 5 dwg, 2 ex
Title | Year | Author | Number |
---|---|---|---|
METHOD OF MAKING MULTILAYER FLEXIBLE-RIGID INTEGRATED BOARDS | 2012 |
|
RU2489814C1 |
METHOD OF MAKING MULTILAYER CONTACT SENSOR IN FORM OF LAMINATED FILM | 2009 |
|
RU2411473C1 |
METHOD OF MAKING ELECTRONIC ASSEMBLIES ON FLEXIBLE SUPPORT WITHOUT SOLDERING AND WELDING PROCESSES | 2014 |
|
RU2572588C1 |
METHOD OF MAKING THIN-FILM MULTILEVEL BOARDS FOR MULTICHIP MODULES, HYBRID INTEGRATED CIRCUITS AND CHIP ASSEMBLIES | 2011 |
|
RU2459314C1 |
METHOD OF MAKING MULTILAYER FILM CONTACT SENSOR | 2014 |
|
RU2577915C1 |
METHOD FOR MANUFACTURING A THREE-DIMENSIONAL MICROASSEMBLY | 2023 |
|
RU2803556C1 |
METHOD TO ASSEMBLE MICROELECTROMECHANICAL DEVICES | 2013 |
|
RU2525684C1 |
PRECISION FLEXIBLE LOOP AND METHOD FOR HIGH DENSITY ASSEMBLY OF ELECTRONIC DEVICE USING SUCH LOOPS | 2005 |
|
RU2312474C2 |
PROCESS OF MANUFACTURE OF CONTACT TRANSDUCER IN THE FORM OF STRATIFIED FILM | 1998 |
|
RU2166740C2 |
METHOD FOR MANUFACTURE OF 3D ELECTRONIC MODULE | 2011 |
|
RU2475885C1 |
Authors
Dates
2016-12-10—Published
2014-12-16—Filed