METHOD OF MANUFACTURING MICROELECTRONIC NODE Russian patent published in 2018 - IPC H01L25/00 H05K3/00 

FIELD: electrical engineering.

SUBSTANCE: invention relates to the field of manufacturing of electronic equipment and can be used to mount microelectronic components in multi-chip modules. It is achieved by the fact that pre-tested and programmed open-frame crystals are placed face-to-face on the technological substrate with a thin adhesive layer of thermoplastic adhesive applied on it, combining contact pads of open-die crystals with reference marks, technological frame is placed onto the technological substrate, aligning the frame window with the reference marks on the technological substrate, bare chips are sealed, gap between the bare chips and the technological frame is filled with a fixing glue, the back side of the bare chips and the technological frame is polished, chip holder is glued, after which the technological substrate is removed by heating it to the melting temperature of the thermoplastic adhesive, then by sequential selective formation of dielectric and conductive layers and a protective layer on the front surface of bare chips, a multilevel commutation of the contact areas of bare chips and external contact areas of the microelectronic assembly that is being manufactured is produced, protruding terminals are formed in the windows of the finishing protective layer, and an microelectronic assembly is cut from the chip holder.

EFFECT: increased density of component placement, which provides an improvement in the mass-dimensional characteristics of the assembly unit.

1 cl, 24 dwg