FIELD: electrical engineering.
SUBSTANCE: invention relates to electronic and electrical engineering. Said technical result is achieved by that printed-circuit boards (1,2,3) are connected by soldered connection of conductive patterns (5-2-2, 5-1) located on adjacent sides of adjacent printed-circuit boards. In middle plate there are through holes (4) for frameless elements. Sealing is carried out by means of closed conducting circuits (5-2-2, 5-1) located around the mounting window and along the perimeter of the sides of the printing unit. Such solution allows also testing prior to final sealing during assembly, as well as analysis of causes of rejects and repair of thermal power plant (three-dimensional electronic assembly), without analyzing it completely.
EFFECT: providing high packing density of assembly components made of at least three printed modules (1,2,3), including caseless (6) and cased components and sealing thereof.
10 cl, 3 dwg
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