METHOD OF ELECTROCHEMICAL DEPOSITION OF PERMALLOY FILMS NiFe FOR INTEGRATED CIRCUITS Russian patent published in 2020 - IPC C25D3/56 

FIELD: physics; chemistry.

SUBSTANCE: invention relates to the field of electroplating, in particular, to the deposition of permalloy alloy Ni₈₁Fe₁₉ to produce magnetically soft material of elements of integral microsystems, which concentrate or screen magnetic field. Method includes deposition from chloride electrolyte containing nickel and iron atoms with congruent composition of alloy by ratio of concentrations Ni/Fe = 4.26, in galvanic bath with vertical arrangement of electrodes at direct current and mixing the electrolyte with deposition of film in local areas of the cathode, limited by a photoresist mask on an oxidised silicon plate, the surface of which is metal-coated with nickel with a sublayer of nichrome and contacts at the edge of the plate with a negative electrode, wherein the anode is a graphite plate, wherein electrolyte contains, mol/l: NiCl₂ 0.0016 ± 5 %, FeCl₂ 0.00037 ± 5%, H₃BO₃ 0.404 ± 20 %, C₇H₅NO₃S 0.0146 ± 50 %, NH₄OH 0.0047 ± 50 %, and electrochemical deposition is carried out at temperature of electrolyte 22 ± 3 °C, pH = 6.0 ± 0.5 and current density 4 ± 1.0 mA/cm².

EFFECT: technical result is production of permalloy films at room temperature with thickness of about 1–20 mcm at low mechanical stress in film on silicon substrates and high magnetic properties.

1 cl, 6 dwg, 1 tbl