FIELD: electroplating.
SUBSTANCE: invention relates to the field of electroplating and can be used to obtain a magnetic material of the elements of integrated microsystems concentrating or shielding a magnetic field. Method involves the deposition of a film in a galvanic bath at a current density of 20 ± 1.0 mA/cm2, temperature 60–70 °C with stirring electrolyte containing nickel chloride NiCl2⋅6H2O and ferric chloride FeCl2⋅4H2O, providing the ratio of the concentrations of nickel atoms and iron NNi/NFe = 4.26, boric acid H3IN3 – 30 g/l, saccharin baking powder C7H5NO3S – 5 g/l, hydrochloric acid HCl (30 %) to obtain a pH of 1.7 ± 10 %, deposition is carried out in local areas limited by a photoresistive mask on an oxidized silicon wafer metallized with nickel with a nichrome underlayer, while the metallized layer is in contact with the nickel cathode electrode on the edge of the plate, the electrolyte is purified from ferric iron by filtering ferric oxide in the preparation, and to compensate for the removed ferric chloride and an increased nickel deposition rate, electrolyte is supplemented with purified ferrous chloride to form the Ni81Fe19 composition, and during the deposition of films by the anode serves the carbon plate.
EFFECT: technical result: improving the reproducibility of the exact composition of permalloy films and improving their magnetic properties.
1 cl, 4 dwg
