FIELD: manufacturing technology.
SUBSTANCE: invention relates to methods of making high-frequency crystal elements of piezoelectric devices. Performing mechanical treatment, chemical cleaning and liquid chemical polishing. Operation of chemical polishing of crystalline plates and/or crystalline elements is carried out in a static mode at normal temperature and with etching rate of not more than 0.008 mcm/min at the stage of removal of the disturbed layer.
EFFECT: simplification of manufacturing process and reduction of spread along thickness.
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