FIELD: electrical engineering, acoustoelectronics, high-frequency quartz resonators, and monolithic quartz filters.
SUBSTANCE: proposed method includes mechanical treatment of quartz plates, their covering with shielding coat, and deep chemical etching; mechanical treatment of quartz plates is followed by chemical polishing in slow hydrofluoric acid based etching solution and mechanical polishing; evaporation of shielding coat is followed by alkali etching of quartz crystal part in the form of inverted MESA-structure; then operation of shielding coat evaporation for protecting work region of inverted mesa-structure against impact of fast etching solution is repeated in the course of dividing blank into crystal parts of inverted mesa-structure; after that quartz crystal parts are finished to attain desired purity by deep chemical etching in hydrofluoric acid.
EFFECT: facilitates manufacture, reduced thickness spread in work region.
1 cl, 2 dwg
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Authors
Dates
2006-11-10—Published
2005-02-09—Filed