FIELD: measuring equipment.
SUBSTANCE: invention relates to measurement equipment, and more specifically to optical profilometry, and can be used to measure surface microrelief produced by any method in arbitrary heterogeneous structure, having different optical characteristics. Essence of the invention lies in the fact that the analyzed structure is uniformly coated with a thin metal layer before taking measurements on the optical profilometer, wherein the layer thickness is determined based on the requirement of negligible reflection of the optical radiation from the back boundary of the metal layer and subsequent sublayers.
EFFECT: technical result is possibility of measuring topological structures or relief surface of sub-tenth-nanometer level (range (1–10) nm) and enlarging range of materials of surface structures, which can be controlled with the help of standard optical profilometers.
1 cl, 2 dwg, 2 tbl
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Authors
Dates
2020-04-02—Published
2019-09-27—Filed