EPOXY COMPOSITION FOR ADHESIVE LAYER AND REINFORCING FILLER BASED THEREON Russian patent published in 2020 - IPC C09J163/10 C08L63/00 C08J5/24 

FIELD: chemistry.

SUBSTANCE: invention relates to production of epoxy polymer compositions used as an adhesive layer for reinforcing fillers, and reinforcing filler used in making parts and structures for aircraft, shipbuilding, helicopter and automotive industry and wind-power engineering from polymer composite materials (PCM) by methods of fluid moulding (VaRTM, RTM, RFI, and so forth). Reinforcing filler includes fibrous filler with adhesive layer for PCM production. Epoxy composition for adhesive layer contains a mixture of difunctional and polyfunctional epoxy resins and thermoplastic. Difunctional epoxy resin is epoxy resin based on bisphenol A with epoxy equivalent weight of 400 to 550 g/eq, polyfunctional epoxy resin selected from a homologous series of nitrogen-containing epoxy resins and epoxy resins based on phenols. Thermoplastic used is a thermoplastic selected from: polyaryl sulphone, polyether sulphone and phenoxy resin, and further comprises a rubber-containing component consisting of core-cladding rubber nanoparticles distributed in bisphenol A-based epoxy resin. Epoxy composition contains said components, with the following ratio of components, wt. %: non-functional epoxy resin based on bisphenol A-15, 0–20.0; polyfunctional epoxy resin - 20.0–28.0; thermoplastic - 4.0–16.0; rubber-containing component 44.0–53.0. Reinforcing filler with adhesive layer includes fibrous reinforcing filler and 2–10 wt. % of said adhesive layer.

EFFECT: mortarless epoxy composition is characterized by high-technology, high stability during prolonged storage and frost resistance, is used as an adhesive layer for reinforcing filler with high adhesion strength, using technology excluding stage of water solvent removal, for creation of PCM with stable physical-mechanical (interlayer strength) and with increased thermomechanical characteristics.

6 cl, 3 tbl, 2 ex