FIELD: physics.
SUBSTANCE: invention relates to processing equipment for vacuum molecular-beam epitaxy of semiconductor structures and can be used as a substrate fixation unit, heated by means of plate or thickened band resistive heater in vacuum units, preferably with fixation of substrate with lower location of its working surface and formation of flows of vapours of semiconductor material, for example, germanium, in direction from below upwards from sublimation sources of said vapours or flows of semiconductor material vapours, for example, germanium and/or silicon, in upward direction from crucible molecular sources based on electron-beam evaporators. In order to achieve the above technical result in the heated substrate fixing assembly according to the first version, comprising a substrate holder installed in the vacuum chamber, configured to fix the substrate, the oriented growth surface to the molecular source, and a resistive heater disposed on the non-working surface side of the substrate, for resistive heater to perform function of substrate holder said resistive heater is made in the form of carrying electroconductive plate or thickened tape, which is provided in the first embodiment with heat-resistant rigid clamps and according to the second embodiment with heat-resistant flat-spring clamps, clamps provide, in both embodiments, fixed fixation of ceramic plates along said plate or thickened tape with the possibility of operational fixation of the substrate with its arrangement along the said plate or the thickened tape with the help of these fixing ceramic plates located on two opposite sides of the substrate, due to clamping of overlying fixing bevels ends of ceramic plates to protruding edges of opposite ends of substrate.
EFFECT: technical result of using the disclosed invention is improved manufacturing ability of the substrate fixation unit, heated by a resistive heater for vacuum molecular-beam epitaxy in a wide range of shapes (rectangular, round and other) and dimensions of used substrate due to equipping of resistive heater made in the form of bearing electroconductive plate or thickened tape by structurally simple fixing ceramic plates and their rigid or flat-spring clamps, providing combination of functions of holder and substrate heater.
14 cl, 6 dwg
Title | Year | Author | Number |
---|---|---|---|
FLAT ELECTRIC HEATER | 0 |
|
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RU2051474C1 |
Authors
Dates
2020-06-11—Published
2019-04-26—Filed