FIELD: electricity.
SUBSTANCE: vacuum sputtering plant comprises a resistive source of an evaporated material connected to a power supply unit, and facing with the first side towards the substrate, on which a semiconductor structure is generated, and with the second one - to a receiver of charged particles connected to a negative terminal of a source of accelerating voltage, to a positive terminal of which voltage is connected. The receiver of charged particles may be arranged in the form of a plate of a refractory metal.
EFFECT: higher stabilisation of an evaporation speed, reproducibility of sputtered material layers by thickness and higher quality of manufactured structures.
4 cl, 1 dwg
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