FIELD: various technological processes.
SUBSTANCE: invention relates to production of metal coatings on substrates from aluminum nitride ceramics and can be used in electronic, electrical and radio engineering industries. Disclosed is a method of producing a metallized aluminum nitride-based ceramic substrate with an adhesive layer. Adhesive layer consists of titanium nitride and alloy of silver, copper and titanium. After photolithographic formation of a metallization pattern, a layer of aluminum nitride ceramic containing inclusions of materials of an adhesive layer is removed by etching in alkaline solutions.
EFFECT: invention enables to manufacture metallized ceramic boards based on aluminum nitride ceramics, in which, after formation of topological pattern of metallization, possibility of overgrowing of electrically insulating gaps during subsequent operations of chemical and electrochemical coating of boards is excluded.
2 cl, 1 tbl
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Authors
Dates
2024-10-09—Published
2023-08-31—Filed