FIELD: metallurgy.
SUBSTANCE: adhesive layer and a layer of copper are applied to the surface of ceramic plates, the copper layer is pressed by plates of copper foil and then heat treated in vacuum. The adhesive layer is formed by vacuum deposition in the form of the system titanium-copper with the thickness of layers 0.1-0.5 microns, on the adhesive layer consistently a copper layer with the thickness 5-15 microns and a silver layer with the thickness 3-12 microns are electroplated then the plates from copper foil are pressed to the surfaces coated with silver and heat treated at the temperature 800-850°C. Heat treatment is performed under the pressure 0.1-0.5 kgf/mm2.
EFFECT: metallisation of substrates with obtaining a qualitative surface without buckling.
2 cl, 1 tbl
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