BAND-SHAPED SOLDERING ALLOY BASED ON GOLD ALLOY AND METHOD FOR PRODUCTION THEREOF Russian patent published in 2020 - IPC B23K35/26 B23K35/40 

FIELD: technological processes.

SUBSTANCE: invention can be used in production of vacuum-tube and semiconductor devices using stepped soldering technology. Solder material is made in the form of a band of gold-tin double alloy of eutectic composition 80Au20Sn equipped with external layers of gold. Thickness of band is 20…50 mcm. Thickness of said layers is calculated from the gold-tin alloy state diagram from the condition of obtaining solder with the specified solidus-liquidus melting temperature range in range from 280 to 500 °C. Total content of gold in solder is not more than 85 wt. %. Application of external layers is performed by sputtering in vacuum, or by chemical deposition, or by electrochemical deposition.

EFFECT: invention enables to obtain composite tape solder with different melting points, which provides reliable soldered connection of structural elements.

2 cl, 2 dwg, 3 tbl, 1 ex