THERMOELECTRIC MODULE MANUFACTURING METHOD AND THERMOELECTRIC MODULE Russian patent published in 2022 - IPC B23K1/00 H01L35/34 H05K3/34 

FIELD: thermoelectric coolers.

SUBSTANCE: invention can be used in the manufacture of thermoelectric coolers used in radio electronics, medicine and devices that are operated mainly under conditions of multiple thermal cycling. A flat billet is formed from thermoelectric material. Its surfaces are covered with an anti-diffusion layer, on top of which a soldering layer and a sacrificial layer are applied. A solder layer is applied over the sacrificial layer, which is an alloy of gold and tin. Thermoelectric branches are formed from the obtained workpiece and placed on the conductive tracks of the first printed circuit board. A second printed circuit board is placed on top to form a thermoelectric module assembly. The specified assembly is heated in a nitrogen atmosphere to a temperature of at least 300°C, then stepwise heating is carried out to a temperature of at least 340°C with holding at this temperature. Cool said assembly to ambient temperature.

EFFECT: invention makes it possible to increase the desoldering temperature to a temperature of at least 350°C with a simultaneous decrease in the thermal load on the thermoelectric module during the soldering process and preserve the electrophysical properties of thermoelectric modules.

12 cl, 7 dwg, 4 tbl, 1 ex