FIELD: aluminum powder metallurgy.
SUBSTANCE: invention relates to the field of aluminum powder metallurgy and can be used to obtain brazed structures from aluminum and alloys based on it. Mixed powder solder for soldering aluminum and alloys based on it contains powders of Al-Si, Al-Cu, Al-Zn, Al-Mg and Al-Sn alloys and has the following chemical composition, wt.%: silicon 9-12, copper 0.005 -4.0, zinc 0.005-4.0, magnesium 0.005-1.5, tin 0.005-1.0, aluminum - the rest. The total content of copper and zinc in the solder does not exceed 7.0 wt.%, and the total amount of copper, zinc, magnesium and tin is from 1 to 9 wt.%.
EFFECT: invention provides a decrease in the solder melting temperature and the possibility of carrying out the soldering process at temperatures below 570°C while increasing the strength of the solder joint.
7 cl, 1 dwg, 3 tbl, 1 ex
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Authors
Dates
2022-09-07—Published
2021-12-09—Filed