METHOD OF METALIZING THERMALLY COMPENSATING INSULATING SUBSTRATE WITH AuSn SOLDER FOR SOLDERING SEMICONDUCTOR LASER DIODES Russian patent published in 2024 - IPC H01L21/02 B23K1/00 

FIELD: metallurgy.

SUBSTANCE: invention can be used to produce permanent joints of semiconductor laser emitters with a temperature compensating substrate by soldering. To obtain a compound, the following layers are successively formed. Layer of gold or copper is applied on the adhesion layer adjoining the surface of the substrate, the thickness of which is selected based on the condition of obtaining the required electrical conductivity of the substrate. Then the second adhesive layer is applied, and then the barrier layer is applied. Layer of tin-gold solder in the form of a monolayer of AuSn alloy is formed on the barrier layer. Then a finishing protective layer of gold is applied. Layer of gold is also deposited on the laser diode. Connection is performed under effect of heat and pressure sufficient for solder melting.

EFFECT: as a result of the method implementation, a composite solder is obtained, which provides a reliable connection, wherein use of sufficient thickness of metal layer with high electrical conductivity enables to use this method for soldering laser diodes with high power.

7 cl, 2 dwg