FIELD: electroplating.
SUBSTANCE: invention relates to electroplating and can be used for electrolytic deposition of zinc-nickel alloy layer on substrate. Method includes interruption of electrolytic deposition of zinc-nickel alloy layer on substrate surface by stopping current supply from external current source to each of soluble zinc anode(s) and to each of soluble nickel anode(s); and wherein after that at least one soluble zinc anode which remains in the electrolysis reaction vessel is electrically connected to the electrical connecting member to form an electrical connection with at least one soluble nickel anode, which remains in the electrolytic reaction vessel, for at least part of a predetermined period of time, in which current is not supplied from an external current source to each of the soluble zinc anode(s) and to each of the soluble nickel anode(s).
EFFECT: prevention of formation of black passivating deposit on surface of soluble zinc anodes.
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Authors
Dates
2020-10-28—Published
2018-08-20—Filed