COPPER ELECTROPLATING FOIL AND METHOD OF PREPARATION THEREOF Russian patent published in 1998 - IPC

FIELD: electroplating. SUBSTANCE: invention concerns low-profile copper foil. In an example presented, such foil has essentially homogeneous randomly oriented grainy structure which, as a matter of fact, does not contain columnar grains and twin boundaries and is characterized by grain size approximately up to 10 mcm. According to example, such foil exhibits tensile strength in the range between 87000 and 120000 lb/sq.inch (600- 828 MPa) as measured at 23 C and elongation at 180 C from 15 to 28%. Manufacturing procedure: copper and sulfate ion-containing electrolyte solution flows between anode and cathode to electrolytically deposit copper on cathode at current density from 0.1 to 5 A/sq.cm, electrolyte solution also containing organic additive or its derivative and chloride ions concentration in solution being about 1 ppm. Copper foil is removed from cathode. EFFECT: improved quality of foil enabling its use in manufacture of printed circuit plates. 44 cl, 13 dwg