METHOD FOR PRODUCING TIN-INDIUM ALLOY COATED COPPER WIRE Russian patent published in 2022 - IPC C25D3/60 

FIELD: electroplating.

SUBSTANCE: invention relates to the field of electroplating and can be used in the production of copper wire coated with alloys based on tin and indium, as well as in the soldering and tinning of electrical elements, integrated circuits, metal surfaces of printed circuit boards and leads of electrical radioelements in household appliances, as well as electrodes, shielding elements, photovoltaic modules, cable and wire products for various purposes. The method includes deposition of a coating in an electrolyte containing tin sulfate, sulfuric acid and indium sulfate, while 2,4-toluene-bis [N, N-dipropyltriethoxysilyl] urea, isopropyl alcohol and butylene glycol are additionally introduced into the electrolyte with the following content of components, g/l: tin sulfate (in terms of metal) 17-35; indium sulfate (in terms of metal) 20-45; sulfuric acid 85-115; 2,4-toluylene-bis[N,N-dipropyltriethoxysilyl]urea 0.1-1.0; isopropyl alcohol 10-15 ml/l; butylene glycol 15-25 ml/l, and the coating is deposited in the mode: temperature, °С 18-35; cathode current density, A/dm² 0.5-7.0; current efficiency, % 85-97, and the indium content in the alloy is 42.0-50.0 wt.%.

EFFECT: increasing the affinity of the copper wire with the alloy at the microcrystalline level and the adhesive strength of the adhesion of the coating to the copper base, the ability to adjust the thickness of the coating, its physical and mechanical properties.

1 cl, 1 tbl, 1 dwg