METHOD FOR MANUFACTURING CONTACT PADS OF HIGH-TEMPERATURE SUPERCONDUCTING WIRE OF SECOND GENERATION AND COMPLEX FOR IMPLEMENTING THE METHOD Russian patent published in 2021 - IPC B23K3/04 H05K3/34 

FIELD: wire production.

SUBSTANCE: inventions can be used to form contact pads of high-temperature superconducting wire of the second generation (hereinafter – HTSC-wire) by soldering. The tight contact of the current terminal with the end section of the HTSC-wire is provided by the pressure of the pressure base with a ball bearing on the manufactured contact pad through the pressure part made of a soft heat-resistant material using solder with a low melting point. The preservation of the structure of the HTSC-wire during soldering is achieved by using a welding base in the form of a hot bench, the heating element of which is placed between the base and the lining of the hot bench. Cooling of the contact pad of the HTSC-wire is carried out by liquid cooling of the welding base and the pressure base with the help of a coil of tubes located over their entire area.

EFFECT: specified modes of heating, feeding the compressive force and liquid cooling of the contact pad of the HTSC-wire ensure that the connection is obtained without damaging the structure of the HTSC-wire.

19 cl, 7 dwg