METHOD FOR DECOUPLING A SEMICONDUCTOR WAFER INCLUDING MULTIPLE STACKS OF SOLAR CELLS Russian patent published in 2021 - IPC H01L31/18 H01L31/224 

FIELD: semiconductor devices.

SUBSTANCE: invention relates to a technology for the production of semiconductor devices. Disclosed is a method for decoupling a semiconductor wafer including several stacks of solar cells along at least one dividing line. The method includes at least the following steps: providing a semiconductor wafer with an upper side, a lower side, an adhesive layer permanently connected to the upper side, and a cover glass layer permanently connected to the adhesive layer, several stacks of solar cells, each of which has a germanium substrate forming the bottom side of the semiconductor wafer, a germanium partial cell and at least two partial cells of III-V groups; performing laser ablation along the dividing line of a dividing groove extending from the bottom side of the semiconductor wafer through the semiconductor wafer and the adhesive layer at least to the bottom side of the cover glass layer adjacent to the adhesive layer, and dividing the cover glass layer along the dividing groove.

EFFECT: invention makes the production of semiconductor devices more effective.

12 cl, 4 dwg