METHOD FOR MANUFACTURE OF AN ELECTRONIC POWER MODULE BY MEANS OF ADDITIVE TECHNOLOGY AND CORRESPONDING SUBSTRATE AND MODULE Russian patent published in 2021 - IPC H01L23/373 

FIELD: electricity.

SUBSTANCE: method for manufacture of an electronic power module by means of additive technology and associated substrate and module. A method for manufacture of an electronic power module (20) by means of additive technology, an electronic module (20) containing a substrate (21) equipped with an electrically insulating plate (24) with opposing first and second front surfaces (24a, 24b) with a first metal layer (25a) located directly on the first front surface (24a) of the insulating plate (24) and a second metal layer (25b) located directly on the second front surface (24b) of the insulating plate (24). At least one of the metal layers (25a) is made following the stage (100) of applying a thin copper layer and the stage (110) of annealing the metal layer (25a, 25b), and the method additionally includes the stage (120) of forming at least one thermomechanical transition layer (271 to 273, 274 to 276) on at least one of the first and the second metal layers (25a, 25b), said at least one thermomechanical transition layer (271 to 273, 274 to 276) comprises a material with a thermal expansion coefficient lower than the thermal expansion coefficient of the metal of the metal layer (25a, 25b).

EFFECT: manufacture of an electronic power module by means of additive technology.

11 cl, 3 dwg