METALISED CERAMIC SUBSTRATE FOR ELECTRONIC POWER PACKS AND METHOD OF CERAMICS METALISATION Russian patent published in 2013 - IPC C04B41/88 C04B37/02 

FIELD: chemistry.

SUBSTANCE: invention relates to application of metal coating on ceramic products and can be used in electronic, electrical engineering and radio engineering industry. Metalised ceramic substrate for electronic power packs contains ceramic plate from aluminium oxide or nitride, with adhesive molybdenum or manganese-based layers, layers of powder-like copper and copper foil plates placed on its top and bottom. Copper foil plates, powder-like copper layers and adhesive layers can have single topological pattern. To carry out metalisation adhesive layers are subjected to burning-in at temperature 1320-1350°C after their application on ceramic plate. Layers of powder-like copper are applied by method of cold gas-dynamic spraying. After that, annealing is performed at temperature 900-1100°C. 100-700 mcm thick copper foil plates are installed on layers of powder-like copper, and annealing is performed at temperature 850-1000°C. Annealing can be carried out under pressure 0.7-1.6 kgf/mm² in hydrogen medium or vacuum. To provide required pressure during annealing substrate can be placed into special fixing arbour.

EFFECT: increased number of metalised ceramics re-heatings to temperature 800°C without loss of adhesion and destruction of metalised coating.

6 cl, 4 ex, 3 dwg