FLEXIBLE CIRCUIT BOARD WITH REDUNDANT CONNECTION POINTS FOR AN ULTRASONIC ARRAY Russian patent published in 2021 - IPC H04R17/00 

FIELD: electronic circuitry.

SUBSTANCE: area of application: the invention relates to ultrasonic systems, more specifically, to ultrasonic systems including a flexible circuit board for connecting to elements of an ultrasonic transducer in an acoustic stack. Substance: flexible circuit boards and methods for ultrasonic transducers are disclosed in the present invention. At least in one implementation, the ultrasonic apparatus includes multiple transducer elements and a flexible circuit board. The flexible circuit board includes an insulating layer with a first surface and a second surface opposing the first surface. The plurality of first conductive pads is included in the first surface of the insulating layer, and each of the first conductive pads is electrically connected with a corresponding transducer element. The plurality of second conductive pads is included in the second surface of the insulating layer, and each of the second conductive pads is electrically connected with a corresponding first conductive pad and a corresponding transducer element.

EFFECT: more reliable signal transmission between the processing, control and/or reception circuits and the elements of the transducer is provided due to improved integrity of the path of the signal through the flexible circuit.

17 cl, 4 dwg