FIELD: chemistry.
SUBSTANCE: present invention relates to polyimides and copolyimides intended for manufacturing dielectric materials that can be used in microelectronics. The polyimides and copolyimides constitute compounds of the general formula:
wherein x=1.2; n = 20 to 100, m = 80 to 0.
EFFECT: obtained compounds exhibit a number of high performance characteristics, including hydrolytic and thermal stability.
1 cl, 1 tbl, 8 ex
Title | Year | Author | Number |
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POLYIMIDES AND COPOLYIMIDES FOR PRODUCING HYDROLYTICALLY AND THERMALLY STABLE POLYIMIDE MATERIALS | 2009 |
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COPOLYMIDES | 1977 |
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1-AMINOMETHYL-3-AMINOETHYLADAMANTANE-MONOMER FOR SYNTHESIS OF POLYIMIDES WITH ENHANCED HYDROLYTIC RESISTANCE | 1985 |
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Authors
Dates
2021-07-19—Published
2020-12-16—Filed