FIELD: measuring equipment.
SUBSTANCE: invention relates to the field of measuring technology for monitoring mechanical deformations, force, mechanical moment, etc. The value of the capacitance of the sensing element under the applied deformation is recorded and the value of the push-pull deformation is converted into the deformation of the dielectric. Conducting plates separated by a layer of elastic dielectric are used as a sensing element, and the transformation of the magnitude of the tensile-compression deformation of the object under study into the deformation of the dielectric is carried out using a rigid tape fixed with tension on the object under study. The sensing element is fixed to the object under study in a pre-compressed state, set and regulated by the tension of a rigid tape.
EFFECT: increased relative sensitivity to the detection of deformation.
1 cl, 5 dwg
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