FIELD: polymers.
SUBSTANCE: invention relates to the development of a heat-resistant low-viscosity epoxy binder for the manufacture of structural polymer composite materials (PCM) with an operating temperature of up to 120°C, which can be used to create products for the energy, construction, aviation, machine-building, shipbuilding industries and in other fields of technology. Described is an epoxy binder for polymer composite materials containing a mixture of epoxy resins and a curing system, characterized in that the mixture of epoxy resins consists of polyfunctional epoxy resins based on N,N,N',N'tetraglycidyl-4,4'-diaminodiphenylmethane, and/or diglycidylaniline, and/or triglycidyl esters of m- and p-aminophenols in an amount of 5 to 45 wt.% of the total weight of the components and high-strength epoxyresorcinol resin in an amount of 10 to 25 wt.% of the total weight of the components, the curing system consists of a latent hardener 4,4'-methylenebis-(3-chloro-2,6-diethylaniline) in an amount of 37 to 45 wt% of the total weight of the components, as well as 4,4'-diaminodiphenylsulfone, or 3, 3'-diaminodiphenylsulfone, or mixtures thereof in an amount of up to 5 wt.% and additionally contains an antifoam in an amount of up to 1.5 wt.% of the total weight of the components.
EFFECT: invention increases the physical and mechanical properties of the epoxy binder while maintaining the technological viability and operating temperature of 120°C.
3 cl, 2 tbl, 10 ex
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Authors
Dates
2021-09-01—Published
2020-11-02—Filed